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| Last Updated: 13/05/2019

Upcoming Event

Past Event

5th International Conference on Advances in Engineering, Science, Technology and Waste Management (AESTWM-17- SINGAPORE) Aug. 8-9, 2017

5th International Conference on Advances in Engineering, Science, Technology and Waste Management (AESTWM-17- SINGAPORE)
8th to 9th August 2017
Singapore, Singapore

The International Refereed Conference Proceedings book with ISBN; CD and certificate of presentation will be distributed to the conference participants at the conference registration desk and papers will be online at the DOI Indexed ISSN Journals

New Submissions are Open and New Full Paper/Abstract/Poster can be submitted Till  JUNE 13, 2017.

Email the formatted paper according to the .doc template paper (in .doc or .docx format) at email id: along with the name and city of the conference.

Topics of interest for submission include, but are not limited to:
- Aeronautical Engineering
- Aerospace Engineering
- Agricultural Engineering
- Architecture & Planning
- Automotive Engineering
- Bio mechanical& Biomedical Engineering
- Bio Technology
- Biological & Bio system Engineering
- Chemical Engineering
- Civil Engineering
- Computer Engineering
- Electrical Engineering
- Electromechanical System Engineering
- Electronics & Communication Engineering
- Engineering Chemistry
- Engineering Management
- Engineering Mathematics
- Engineering Physics
- Engineering Sciences
- Environment Engineering
- Food Engineering
- Forensic Engineering
- Forestry Engineering
- Gas Engineering
- Geological Engineering
- Industrial Engineering
- Manufacturing Engineering
- Marine Engineering
- Mineral & Metallurgical Engineering
- Mining Engineering
- Mechanical Engineering  
- Nanotechnology
- Natural Sciences, Humanities
- Nuclear Engineering
- Ocean Engineering
- Oil Engineering
- Petroleum Engineering
- Production Engineering
- Software Engineering
- Sound Engineering
- Structural Engineering
- System Engineering
- Telecommunication Engineering
- Water Resource Engineering

Web address:
Sponsored by: IICBE
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